Yamaha S10 SMD Dizgi Makinesi

3D MID Özellikli Çok Fonksiyonlu Sistem

SMD Dizgi ile birlikte 3D MID* ve çok fonksiyonlu özellikleri ile dünyada başka benzeri olmayan bir dizgi platformuna sahip olun

*3D MID: kalıplanmış iç bağlantı aygıtı

Model	S10
Board size (with buffer unused)	Min. L 50 x W 30 mm to Max. L 1,330 x W 510 mm (Standard L 955)
Board size (with input or output buffers used)	Min. L 50 x W 30 mm to Max. L 420x W 510 mm
Board size (with input and output buffers used)	Min. L 50 x W 30 mm to Max. L 330x W 510 mm
Board thickness	0.4 – 4.8 mm
Board flow direction	Left to right (Std)
Board transfer speed	Max 900 mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.	0.08 sec/CHIP (45,000 CPH)
Placement accuracy A (μ+3σ)	CHIP +/- 0.040 mm
Placement accuracy B (μ+3σ)	IC +/- 0.025 mm
Placement angle	+/- 180 degrees
Z axis control/ Theta axis control	AC servo motor
Component height	Max 30 mm^*1 (Pre-placed components: max 25 mm)
Applicable components	0201 mm – 120 x 90 mm, BGA, CSP, connector, etc.
Component package	8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray
Drawback check	Vacuum check and vision check
Screen language	English, Chinese, Korean, Japanese
Board positioning	Board grip unit, front reference, auto conveyor width adjustment
Component types	Max 90 types (8 mm tape), 45 lanes x 2
Transfer height	900 +/- 20 mm
Machine dimensions, weight	L 1250 x D 1750 x H 1420 mm, Approx. 1150 kg
*1) Board thickness + Component height = Max 30mm Some specifications and parts of the external appearance are subject to change without notice.

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